Direct Transfer Bonding of Ultra-thin Warped Chips for Advanced Heterogeneous 3DIC Integration with Fine-pitch Direct/Hybrid Bonding
Fields of Study & Subjects
3D IC and TSV technologies
Electronic Packaging and Soldering Technologies
Electrical and Thermal Properties of Materials
Publication details
- Journal / source
- 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
- Publisher
- IEEE
- Pages
- 2070–2076
- Publication date
- 26 May 2026