Comprehensive Characterization of Surface Activation for Chip-to-Wafer Hybrid Bonding in 3D Flash Memory

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Jingqi Zhang, Bungo Tanaka, Murugesan Mariappan, Chang Liu, Tetsu Tanaka, Takafumi Fukushima
DOI: 10.1109/ectc51846.2026.00351
Cited by: 1
References: 8

Fields of Study & Subjects

3D IC and TSV technologies Nanofabrication and Lithography Techniques Advanced Surface Polishing Techniques

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
2134–2140
Publication date
26 May 2026