High-Throughput Metrology of CMP-treated Surface Topography using Fizeau Interferometry for Hybrid Bonding

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Ryoichi Sato, Hashimoto Hiroyuki, Bungo Tanaka, Kota Sasaki, Murugesan Mariappan, Nishiyama Kohei, Yuki Fujii, Tetsu Tanaka, Takafumi Fukushima
DOI: 10.1109/ectc51846.2026.00352
Cited by: 1
References: 23

Fields of Study & Subjects

Optical measurement and interference techniques Advanced Surface Polishing Techniques Nanofabrication and Lithography Techniques

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
2141–2146
Publication date
26 May 2026