Interfacial Analysis of Hybrid Bonding Using Water Surface Tension-Driven Self-Assembly for HBM

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Kota Sasaki, Bungo Tanaka, Ryoichi Sato, Hayato Hishinuma, Tetsu Tanaka, Takafumi Fukushima
DOI: 10.1109/ectc51846.2026.00353
Cited by: 1
References: 30

Fields of Study & Subjects

Modular Robots and Swarm Intelligence Advanced Surface Polishing Techniques 3D IC and TSV technologies

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
2147–2152
Publication date
26 May 2026