High-Density Dual-Bit Charge Trapping Flash Memory: Design, Process Optimization, and Performance Evaluation
Abstract
A high-density NOR array utilizing dual-bit charge trapping flash (CTF) technology is proposed, integrating a select gate structure and bit-line sharing architecture to achieve a compact cell size of 0.03 µm2/bit with Quad-Bit Cells (QBC) storage ability. Through advanced process optimization, the array demonstrates >98% yield, superior device uniformity, and narrow parameter distributions, including threshold voltage (VTH) and maximum transconductance (gm). The design ensures robust crosstalk immunity and high reliability, enabling efficient multi-level cell operation for next-generation nonvolatile memory applications.
Fields of Study & Subjects
Semiconductor materials and devices
Advancements in Semiconductor Devices and Circuit Design
Ferroelectric and Negative Capacitance Devices
Publication details
- Journal / source
- 2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Publisher
- IEEE
- Pages
- 1–3
- Publication date
- 1 March 2026