Design and Analysis of a Stacked Silicon Wafer-Based Technology for Multilayer Multi-Chip Modules

2026

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Authors: Ilya A. Solovyov, Andrey Titov, Denis V. Vertyanov

DOI: 10.1109/elcon-mn69838.2026.11417101

Cited by: 0

References: 13

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Silicon Carbide Semiconductor Technologies

References 13