AI-Based Vision System for Real-Time Solder Joint Quality Inspection In Robotic Soldering

2026 International Conference on Emerging Technologies and Future Innovations (ETFI) 2026

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Authors: R Nambu Narayanan, S M Hariharan, R Lokesh, R Vijay, T Kalai Selvi, S Senthil Pandi
DOI: 10.1109/etfi68128.2026.11484798
Cited by: 14
References: 15

Fields of Study & Subjects

Industrial Vision Systems and Defect Detection Electronic Packaging and Soldering Technologies Robot Manipulation and Learning

Publication details

Journal / source
2026 International Conference on Emerging Technologies and Future Innovations (ETFI)
Publisher
IEEE
Pages
1–7
Publication date
12 February 2026