WATOS: Efficient LLM Training Strategies and Architecture Co-Exploration for Wafer-Scale Chip

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Authors: Huizheng Wang, Zichuan Wang, Hongbin Wang, Jialin Hou, Tingcha Wei, Chao Li, Yuanming Hu, Shouyi Yin
Cited by: 2
References: 120

Abstract

Training large language models (LLMs) imposes extreme demands on computation, memory capacity, and interconnect bandwidth, driven by their ever-increasing parameter scales and intensive data movement. Wafer-scale integration offers a promising solution by densely integrating multiple single-die chips with high-speed die-to-die (D2D) interconnects. However, the limited wafer area necessitates trade-offs among compute, memory, and communication resources. Fully harnessing the potential of wafer-scale integration while mitigating its architectural constraints is essential for maximizing LLM training performance. This imposes significant challenges for the co-optimization of architecture and training strategies. Unfortunately, existing approaches all fall short in addressing these challenges. To bridge the gap, we propose WATOS, a co-exploration framework for LLM training strategy and wafer-scale architecture. We first define a highly configurable hardware template designed to explore optimal architectural parameters for waferscale chips. Based on it, we capitalize on the high D2D bandwidth and fine-grained operation advantages inherent to wafer-scale chips to explore optimal parallelism and resource allocation strategies, effectively addressing the memory underutilization issues during LLM training. Compared to the state-of-the-art (SOTA) LLM training framework Megatron and Cerebras' weight streaming wafer training strategy, WATOS can achieve an average overall throughput improvement of$2.74 \times$and$1.53 \times$across various LLM models, respectively. In addition, we leverage WATOS to reveal intriguing insights about wafer-scale architecture design with the training of LLM workloads.

Fields of Study & Subjects

3D IC and TSV technologies Advancements in Photolithography Techniques Silicon and Solar Cell Technologies

Publication details

Journal / source
2026 IEEE International Symposium on High Performance Computer Architecture (HPCA)
Publisher
IEEE
Pages
1–19
Publication date
31 January 2026