On-chip Rolled-up Nanomembrane RF Filters

On the RF/microwave and power chips, the number of transistors is relatively small, while basic passive electronic components (e.g., inductors and capacitors) not only dominate in quantity but also occupy the majority of the chip area, becoming a bottleneck for miniaturization. The fundamental reason for this lies in the fact that passive electronic components developed using conventional planar semiconductor processes are limited to 2D or 2.5D structures, resulting in weak electromagnetic field confinement and thus low achievable energy density. To address this challenge, it is necessary to fundamentally break the existing 2D/2.5D framework for monolithic passive electronic components by implementing true 3D structures on-chip, based on conventional planar semiconductor processes. In recent years, high-integration 3D rolled-up structures on-chip have been realized by leveraging planar film stress, offering a transformative solution. In this talk, I will present the following achievements over the past years using rolled-up thin-film nanotechnology: fabrication of complex 3D rolled structures on-chip, design and manufacturing of high performance miniaturized passive components, along with their applications in RF filters.