23.4 A 6.4Tb/s 4.2pJ/b Co-Packaged Optics ASIC with Direct-Drive Integrated TIA and Retimed Segmented Mach-Zehnder Modulator Driver in 7nm FinFET

Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference 2026

View at publisher
Authors: Mahdi Kashmiri, Ajay Yadav, Jin Namkoong, Behrooz Nakhkoob, Tony Shuo-Chun Kao, Shen Shen, Vaibhav Pandey, Kuan-Chang Chen, Jinho Han, Sudheer Gaddam, Shayan Kazemkhani, Sang Young Kim
+4 more Simar Maangat, Bo Nguyen, Mike Robinson, Hiva Hedayati
DOI: 10.1109/isscc49663.2026.11409070
Cited by: 0
References: 1

Abstract

A$6.4 ~\text{Tb} / \mathrm{s}$co-packaged optics ASIC integrates 64 ingress path direct-drive TIAs and 64 egress path retimed segmented Mach-Zehnder modulator drivers in 7 nm FinFET. The 7 nm ASIC is 3D packaged with a photonics IC (PIC) and achieves an energy efficiency of$4.2 \text{pJ} / \mathrm{b}$. At$106.25 ~\text{Gb} / \mathrm{s}$, its PAM-4 TIA has a sensitivity better than −11 dBm and a BER floor better than 1E-9. The transmitted PAM-4 optical eye achieves a TDEQ of 1.48 dB and an extinction ratio of 4.57 dB.

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices Advanced Photonic Communication Systems

Publication details

Journal / source
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
Pages
402–404
Publication date
15 February 2026
Language
EN