10.2 A Dynamic Performance Augmentation in a 3nm-Plus Mobile CPU

Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference 2026

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Authors: Chien-Yu Lu, Bo-Jr Huang, Sung S.-Y. Hsueh, Trong-Hieu Tran, Eric Jia-Wei Fang, Chao-Yang Yeh, Quan Sun, Tao Chen, Hsinchen Chen, Huaichung Chang, C.-J. Tsai, Yi-Chang Zhuang
+4 more Barry Y. Chen, Ericbill Wang, Hugh Mair, Shih-Arn Hwang
DOI: 10.1109/isscc49663.2026.11409197
Cited by: 0
References: 6

Abstract

This work presents dynamic mobile-performance augmentation (DMPA), featuring boosting-duty control (BDC) and an adaptive thermal cooler (ATC) to augment CPU maximum performance. The BDC uses an aging sensor (A-sensor) to leverage an aging budget for performance boosting. For thermal, the ATC integrates temperature sensors (T-sensors) across the CPU and works with multiple sensors and a throttler to optimize clock speed effectively cooling hotspots. The DMPA offers a score of 3917 in the GeekBenchv6 single-core benchmark on a flagship smartphone, consuming 0.078% or less total power, while occupying only 0.0122% of the CPU area.

Fields of Study & Subjects

Parallel Computing and Optimization Techniques Low-power high-performance VLSI design Real-Time Systems Scheduling

Publication details

Journal / source
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
Pages
170–172
Publication date
15 February 2026
Language
EN