7.1 54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation

Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference 2026

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Authors: Neale A. W. Dutton, Xavier Branca, Mathieu Thivin, Steven Collins, Herve Thuaire, Fabrice Martin, Vincent Clemencon, Mohammed A. Al-Rawhani, Duncan Hall, Axel Crocherie, Cédric Pastorelli, Sophie Taupin
+5 more Severin Trochut, Abhishek Singh, Andreas Asmann, Bruce R. Rae, Pascal Mellot
DOI: 10.1109/isscc49663.2026.11409221
Cited by: 0
References: 6

Abstract

We report a$54 \times 42$-resolution SPAD-based LIDAR receiver SoC leveraging 3D-stacked$65 / 40 ~\text{nm}$technology with high-frequency TDC and 2 counters for ToF and intensity exposure, with peripheral memories used for image signal processing (ISP) frame stores, point cloud generation & HDR management. A hybrid on-chip & package-embedded 25V boost converter is described integrating SPAD supply generation synchronized with sensor frame timing. The sensor is integrated in a LIDAR module for 9.6m ranging with

Fields of Study & Subjects

Advanced Optical Sensing Technologies 3D IC and TSV technologies Semiconductor Lasers and Optical Devices

Publication details

Journal / source
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
Pages
112–114
Publication date
15 February 2026
Language
EN