Session 8 Overview: Die-to-Die and High-Speed Electrical Transceivers

Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference 2026

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DOI: 10.1109/isscc49663.2026.11409333
Cited by: 0

Fields of Study & Subjects

3D IC and TSV technologies Semiconductor Lasers and Optical Devices Interconnection Networks and Systems

Publication details

Journal / source
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
Pages
132–133
Publication date
15 February 2026
Language
EN