Reliability Analysis of IGBT Module Under Plateau Environment Based on Electro-Thermal-Mechanical Coupling

IEEE Journal of the Electron Devices Society 2026 Open access

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Authors: Yiyang Bu, Hui Wang

DOI: 10.1109/jeds.2026.3661979

Cited by: 0

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Reliability and Maintenance Optimization Electronic Packaging and Soldering Technologies