Guest Editorial: High Power Density Power Converters Achieved by Device and Components Integration

IEEE Journal of Emerging and Selected Topics in Power Electronics 2026

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Authors: Laili Wang, Alan Mantooth, Yan‐Fei Liu
DOI: 10.1109/jestpe.2026.3652261
Cited by: 0

Fields of Study & Subjects

Advanced DC-DC Converters Multilevel Inverters and Converters Silicon Carbide Semiconductor Technologies

Publication details

Journal / source
IEEE Journal of Emerging and Selected Topics in Power Electronics
Volume
14
Issue
1
Pages
4–5
Publication date
1 February 2026