Distributed Split Single-Sideband Time-Modulated Arrays for Secure Communications

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Authors: Yue Ma, Ruiqian Ma, Zhi Lin, Chen Miao, Ruoyu Zhang, Weijun Long, Wen Wu, Jiangzhou Wang
Cited by: 16
References: 41

Abstract

In recent years, physical layer security (PLS) techniques have been paid considerable attention due to its high-security level and strong compatibility. However, the request of the superior legitimate channel is the Achilles’ Heel of PLS. A significant challenge exists in ensuring information confidentiality when the eavesdropper locates at user’s direction in the multi-antenna system. To overcome this limitation, we propose a novel framework to achieve secure communication via distributed split single sideband (SSB) time modulated array (TMA). By strategically dividing the I/Q paths of the transmitted signals into geographically separated subarrays, we establish the non-aliasing zone to achieve error-free communication for legitimate user (LU), while the eavesdropper positioned in the aliasing zone receives irrecoverably disturbed waveform. To assess performance, we adopt the encoder-decoder-based deep neural network to optimize the time-switching sequence, ensuring the subarrays’ spatial radiation areas overlap exclusively at the LU. A specialized loss function is formulated to enhance the interference-to-signal ratio by increasing the −1stto the +1stharmonic power ratio in non-LU regions. Furthermore, the joint optimization improves security by focusing energy on the LU while generating interference in non-LU areas. The bit error rate (BER) is used as the metric, and the simulation results validate the effectiveness of the proposed method, ensuring reliable transmission and increasing Eve’s BER to approximately 0.5, thereby compromising her ability to intercept the communication.

Fields of Study & Subjects

Antenna Design and Optimization Antenna Design and Analysis Advanced Antenna and Metasurface Technologies

Publication details

Journal / source
IEEE Internet of Things Journal
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
13
Issue
11
Pages
23862–23875
Publication date
6 March 2026