Resonant Pressure Sensor With On-Chip Integrated Diode for Rapid Temperature Change in Aerospace

Resonant Pressure Sensors (RPS) are key for high-precision MEMS pressure measurement, but traditional Off-Chip Temperature Sensors (OFTS) suffer heat conduction lag under rapid temperature change, limiting accuracy in aircraft rapid maneuvering. To address this bottleneck, this study proposes a novel RPS scheme integrating resonant and diode temperature-sensitive structures. By combining an On-Chip Integrated Temperature Sensor (OCITS) and a frequency-temperature dual-parameter 4th-order polynomial compensation algorithm, high-precision pressure measurement under rapid temperature change is achieved. A COMSOL multi-physics model compares OCITS and OFTS responses at 0.1 to 10 °C/min: at 1 °C/min, OCITS exhibits ≤50 ms delay (vs. 946 s for OFTS) with ≤0.3 °C tracking error; at 10 °C/min, OCITS maintains synchronization while OFTS loses validity (error >62.4 °C). Prototypes were fabricated via the DRIE bulk silicon process and tested under dynamic temperature-pressure conditions. Experiments show: OCITS achieves synchronous response at 10 °C/min， within −55 °C to 100 °C and 3.5 kPa to 285 kPa, comprehensive accuracy reaches 0.0038% full scale (FS) which is 3.68 times higher than that of OFTS (0.014% FS). This work addresses the pressure measurement bottleneck of aircraft during rapid maneuvering, providing a reliable solution for high-precision MEMS sensors in aerospace.