LEL: Lipschitz Continuity Constrained Ensemble Learning for Efficient EEG-Based Intrasubject Emotion Recognition

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Authors: Shengyu Gong, Yueyang Li, Zijian Kang, Bo Chai, Weiming Zeng, Hongjie Yan, Zhiguo Zhang, Wai Ting Siok, Nizhuan Wang
Cited by: 3
References: 55

Abstract

Accurate and efficient recognition of emotional states is critical for human social functioning, and impairments in this ability are associated with significant psychosocial difficulties. While electroencephalography (EEG) offers a powerful tool for objective emotion detection, existing EEG-based Emotion Recognition (EER) methods suffer from three key limitations: (1) insufficient model stability, (2) limited accuracy in processing high-dimensional nonlinear EEG signals, and (3) poor robustness against intra-subject variability and signal noise. To address these challenges, we introduce Lipschitz continuity-constrained Ensemble Learning (LEL), a novel framework that enhances EEG-based emotion recognition by enforcing Lipschitz continuity constraints on Transformer-based attention mechanisms, spectral extraction, and normalization modules. These heterogeneous constraints bound the global Lipschitz constant via function composition, ensures model stability, reduces sensitivity to signal variability and noise, and improves generalization capability. Additionally, LEL employs a learnable ensemble fusion strategy that optimally combines decisions from multiple heterogeneous classifiers to mitigate single-model bias and variance. Extensive experiments on three public benchmark datasets (EAV, FACED, and SEED) demonstrate superior performance, achieving average recognition accuracies of 74.25% ± 2.3, 81.19% ± 2.8, and 86.79% ± 1.9, respectively. The official implementation codes are available at https://github.com/NZWANG/LEL.

Fields of Study & Subjects

Emotion and Mood Recognition EEG and Brain-Computer Interfaces Sleep and Work-Related Fatigue

Publication details

Journal / source
IEEE Sensors Journal
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
26
Issue
9
Pages
13446–13456
Publication date
16 March 2026