A 77-fJ/bit 8-Gbps Adaptive-Voltage-Compatible Self-Timed Die-to-Die Link for 2.5-D and 3-D Interconnect in 3 nm

IEEE Journal of Solid-State Circuits 2026

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Authors: Brian Zimmer, Stephen G. Tell, C. Thomas Gray

DOI: 10.1109/jssc.2026.3658215

Cited by: 0

References: 14

Fields of Study & Subjects

3D IC and TSV technologies Interconnection Networks and Systems Semiconductor Lasers and Optical Devices

References 14