A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE
Abstract
This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling phase shifter (ILTPS), which enables both frequency tripling and phase shifting within a single circuit without multi-stage amplifiers. The ILTPS achieves an area of 0.088 mm2and a power consumption of 15 mW. In addition, to realize high power density, the transceiver integrates a bi-active sub-harmonic mixer (BA-SHM) and a D-band PA/LNA with PA-sharing TDD switching. An eight-element antenna-in-package (AiP) module using two transceiver ICs operates in the 142–164-GHz frequency range, achieving an EIRP of 25.7 dBm and a maximum data rate of 56 Gbps. The power consumption per element is 150 mW in TX mode and 93 mW in RX mode with 1 V VDD. The active area of this transceiver is 8.5 mm2, and it is implemented using a 65 nm CMOS process.
Fields of Study & Subjects
Radio Frequency Integrated Circuit Design
Advancements in PLL and VCO Technologies
Millimeter-Wave Propagation and Modeling
Publication details
- Journal / source
- IEEE Journal of Solid-State Circuits
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Volume
- 61
- Issue
- 4
- Pages
- 1275–1293
- Publication date
- 3 March 2026