A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE

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Authors: Yudai Yamazaki, Yohei Morishita, Sunghwan Park, Takaya Uchino, Chenxin Liu, Jun Sakamaki, Akihiro Egami, Ryosuke Hasaba, Ken Takahashi, Tomoki Abe, Tomohiro Murata, Y. Nakagawa
+28 more Takashi Tomura, Hiroshi Taneda, Kei Murayama, Makoto Tsukahara, Hiroko Ota, Yoko Nakabayashi, Ryuji Kinugawa, Takumi Kojima, Anyi Tian, Kotaro Ito, Chun Wang, Hans Herdian, Yi Zhang, Zheng Li, Wenqian Wang, Hóngyè Huáng, Dingxin Xu, Sena Kato, Michihiro Ide, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Yuncheng Zhang, Hiroyuki Sakai, Kazuaki Kunihiro, Atsushi Shirane, Koji Takinami, Kenichi Okada
Cited by: 1
References: 53

Abstract

This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling phase shifter (ILTPS), which enables both frequency tripling and phase shifting within a single circuit without multi-stage amplifiers. The ILTPS achieves an area of 0.088 mm2and a power consumption of 15 mW. In addition, to realize high power density, the transceiver integrates a bi-active sub-harmonic mixer (BA-SHM) and a D-band PA/LNA with PA-sharing TDD switching. An eight-element antenna-in-package (AiP) module using two transceiver ICs operates in the 142–164-GHz frequency range, achieving an EIRP of 25.7 dBm and a maximum data rate of 56 Gbps. The power consumption per element is 150 mW in TX mode and 93 mW in RX mode with 1 V VDD. The active area of this transceiver is 8.5 mm2, and it is implemented using a 65 nm CMOS process.

Fields of Study & Subjects

Radio Frequency Integrated Circuit Design Advancements in PLL and VCO Technologies Millimeter-Wave Propagation and Modeling

Publication details

Journal / source
IEEE Journal of Solid-State Circuits
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
61
Issue
4
Pages
1275–1293
Publication date
3 March 2026