Miniaturized Wideband Filtering Antenna on Glass Substrate for mm-Wave AiP

This letter presents a miniaturized wideband millimeter-wave (mm-wave) filtering antenna with high out-of-band suppression, implemented on a glass substrate using through-glass via (TGV) technology. The antenna topology integrates a primary radiating patch with parasitic elements and a set of planar inverted-F antennas (PIFAs). The PIFA structures, enabled by metallized vias, are key to achieving both a wide impedance bandwidth and a sharp gain roll-off in the lower stopband. Concurrently, two sets of slots etched onto the main patch introduce two additional radiation nulls to ensure strong suppression in the upper stopband. The single antenna element maintains a compact footprint of 0.7 λ0 × 0.56 λ0 × 0.065 λ0 (@ 24 GHz). For experimental validation, a 1 4 linear array was fabricated and measured. The measured results demonstrate a 10-dB bandwidth of 21.8 - 30 GHz ( 31.7%) and a peak gain of 10.7 dBi. The three well-defined radiation nulls collectively provide over 13 dB of out-of-band suppression. The combination of wideband filtering performance, compact footprint, and a silicon-compatible glass-based platform make the proposed antenna an excellent candidate for highly integrated Antenna-in-Package (AiP) solutions for 5G and beyond mm-wave communication systems.