Atomic Diffusion Bonding of Wafers in Air Using Single-Sided Au Film Deposition with Zr Underlayer

2026 9th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 2026

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Authors: T. Ohara, Y. Otsuki, A. Miura, M. Uomoto, T. Shimatsu
DOI: 10.1109/ltb-3d69101.2026.11555083
Cited by: 1
References: 3

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

Publication details

Journal / source
2026 9th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Publisher
IEEE
Pages
1–1
Publication date
13 May 2026