Introduction to the Series of Review Papers on the Transactions on Signal and Power Integrity
Abstract
The EMC Society launched in 2022 a new publication, the IEEE Transactions on Signal and Power Integrity, co-sponsored by MTTS, CEDA, and EP-S, and led by the Editor-in-Chief Prof. Jun Fan. This journal is the perfect location for hosting scientific and research papers addressing all aspects of signal and power integrity of an electronic system and its components, ranging from integrated circuits and packages to PCBs, from cables and connectors to microelectronic components. Moreover, the latest advancements in the theory, algorithms, design approaches and modeling for ensuring the fidelity and performance of digital, analog, and hybrid electronic systems and sub-systems are the main subjects appearing in the papers published in the past three years.
Fields of Study & Subjects
Electromagnetic Compatibility and Noise Suppression
Electromagnetic Compatibility and Measurements
Microwave Engineering and Waveguides
Publication details
- Journal / source
- IEEE Electromagnetic Compatibility Magazine
- Volume
- 15
- Issue
- 1
- Pages
- 38–38
- Publication date
- 1 January 2026
- Language
- EN