Evaluation of Temporary Bonding Techniques for Pfas-Free Polymer Integration in Mems Devices

Recent advances in piezoelectric MEMS have shifted from pure-silicon platforms to hybrid polymer-Si architectures to overcome performance limitations and expand functionality. Implementing rigid-flexible (polymer-Si) designs on thin substrates with emerging PFAS-free polymers necessitates reliable temporary bonding methods. This work evaluates four industrially compatible bonding/debonding techniques using liquid adhesive and dry tape for fabricating suspended$\text{Si}-{}$polymer structures on 8 -inch wafers with SU-8 dry film (DF). The fabricated structures enable direct mechanical characterization via compression testing and continuous stiffness measurement (CSM). These insights into bonding strategies and polymer properties pave the way for integration of emerging PFAS-free polymers into MEMS technologies.