A Thermocompression Bonded Magnetically Graded Magnetoelectric Antenna for Efficient Data Transfer in Implantable Electronics

A thermocompression bonded magnetically graded magnetoelectric antenna (MEA) for efficient data transfer in implantable electronics is demonstrated. The proposed MEA is developed using Metglas and an electroplated nickel layer as the substrate, which serves as the magnetostrictive layer, with a piezoelectric (PVDF) spincoated layer on top. Finally, using optimized temperature and pressure, the PVDF-PVDF interface is bonded to form two different ME heterostructures: Metglas/PVDF/Metglas (M/P/M) and Metglas/Nickel/PVDF/Nickel/Metglas ($\mathrm{M} / \mathrm{N} / \mathrm{P} / \mathrm{N} / \mathrm{M}$). The overall dimension of the MEA is$3.5 \times 5 ~\text{mm}^{2}$, enabling operation at a low frequency of 48 kHz. This technique eliminates the need for epoxy layers, resulting in improved noise immunity, better strain transfer and supports high data transfer rates of up to 2 kHz for near-field communication in implantable bioelectronics.