LLM-Empowered Agentic AI for QoE-Aware Network Slicing Management in Industrial IoT

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Authors: Xudong Wang, Lei Feng, Ruichen Zhang, Fanqin Zhou, Hongyang Du, Wenjing Li, Dusit Niyato, Abbas Jamalipour, Ping Zhang
Cited by: 2

Abstract

The Industrial Internet of Things (IIoT) requires networks that deliver ultra-low latency, high reliability, and cost efficiency, which traditional optimization methods and deep reinforcement learning (DRL)-based approaches struggle to provide under dynamic and heterogeneous workloads. To address this gap, large language model (LLM)-empowered agentic AI has emerged as a promising paradigm, integrating reasoning, planning, and adaptation to enable QoE-aware network management. In this paper, we explore the integration of agentic AI into QoE-aware network slicing for IIoT. We first review the network slicing management architecture, QoE metrics for IIoT applications, and the challenges of dynamically managing heterogeneous network slices, while highlighting the motivations and advantages of adopting agentic AI. We then present the workflow of agentic AI-based slicing management, illustrating the full lifecycle of AI agents from processing slice requests to constructing slice instances and performing dynamic adjustments. Furthermore, we propose an LLM-empowered agentic AI approach for slicing management, which integrates a retrieval-augmented generation (RAG) module for semantic intent inference, a DRL-based orchestrator for slicing configuration, and an incremental memory mechanism for continual learning and adaptation. Through a case study on heterogeneous slice management, we demonstrate that the proposed approach significantly outperforms other baselines in balancing latency, reliability, and cost, and achieves up to a 19% improvement in slice availability ratio.

Fields of Study & Subjects

Software-Defined Networks and 5G IoT and Edge/Fog Computing Advanced Computing and Algorithms

Publication details

Journal / source
IEEE Network
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
40
Issue
3
Pages
202–210
Publication date
27 February 2026
Language
EN