Development of Microwave SQUID Multiplexer for Readout of Transition-Edge Sensor Array

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Authors: Zhi-Fa Feng, Xianfeng Zhou, Wen Zhang, Zheng Wang, Qingxiao Ma, Peizhan Li, Jia-Qiang Zhong, Wei MIAO, Yuan Ren, Qi-Jun Yao, Valery Koshelets, Lyudmila Filippenko
+3 more Michael Fominsky, J. X. Li, Sheng-Cai Shi
Cited by: 1
References: 23

Abstract

Superconducting transition-edge sensors (TESs) with high sensitivity can detect electromagnetic wave radiations from millimeter/submillimeter, optical to x/γ rays, and have been successfully used in many fields. To improve detection efficiency and sensitivity, large-scale TES arrays are required in combination with multiplexing readout electronics. Compared to other multiplexing schemes, microwave SQUID multiplexing (μMUX), consisting of high-quality microwave superconducting resonators and RF SQUIDs, is most suitable since it provides a wider bandwidth (GHz) and consequently higher multiplexing factor. We designed two types of circuits with different mutual inductances (MT) between the resonator and the RF SQUID: 2.3 pH for the weak-coupling channel and 6.5 pH for the strong- coupling channel. The resonator and RF SQUID washers made of 150 nm Nb are first fabricated by magnetron-sputtering and reactive ion etching (RIE), followed by deposition of Nb/Al-AlOx/Nb trilayer and definition of the Josephson junctions of the RF SQUIDs. This work presents a μMUX demonstration chip with five channels with Q1values of 787 and 3626, and the measured frequency shifts (Δfpp) of ∼500 kHz and 4 MHz for the weak- and strong-coupling channels, respectively. The open-loop equivalent noise current, obtained from the measured phase noise and resonator responsivity, is ∼80 pA/ √Hz with the strong-coupling channel.

Fields of Study & Subjects

Superconducting and THz Device Technology Atomic and Subatomic Physics Research Terahertz technology and applications

Publication details

Journal / source
IEEE Transactions on Applied Superconductivity
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
36
Issue
6
Pages
1–6
Publication date
14 January 2026