Study on Quench Behavior of Aluminum-Stabilized Stacked REBCO Tapes Cable

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Authors: Qingyuan Li, M. Wang, Yatian Pei, Fan Ren, Yuanlong Ding, Qingjin Xu, Wei Pi, Feipeng Ning
Cited by: 1
References: 15

Abstract

The Circular Electron Positron Collider (CEPC) represents a major international scientific project, with its detector magnet proposing the use of the Aluminum-stabilized Stacked REBCO Tapes Cable (ASTC) in its High-Temperature Superconducting (HTS) design. To ensure the long-term stable and safe operation of this magnet, a thorough investigation on the quench behavior of the ASTC is imperative. This paper presents a comprehensive three-dimensional quench simulation model for the ASTC, incorporating coupled electromagnetic-thermal analysis. The model is employed to simulate the global quench characteristics of the cable under liquid nitrogen immersion cooling, explicitly accounting for internal electrical contact resistance and thermal contact resistance. Key quench parameters, namely the Minimum Quench Energy (MQE) and Quench Propagation Velocity (QPV), are investigated under varying operational currents, with particular emphasis on performance under adiabatic conditions representing the worst-case scenario. Simulation results demonstrate the significant role of the aluminum stabilizer in current sharing and heat conduction, contributing to the cable's stability and recoverability. The study confirms that the ASTC exhibits robust operational stability, where local quenches are unlikely to propagate into global quench events under effective cooling, thereby validating its suitability for the CEPC detector magnet application. The developed multi physics model and simulation methodology provide a valuable framework for subsequent quench analysis of superconducting magnets.

Fields of Study & Subjects

Superconducting Materials and Applications Physics of Superconductivity and Magnetism Superconductivity in MgB2 and Alloys

Publication details

Journal / source
IEEE Transactions on Applied Superconductivity
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
36
Issue
7
Pages
4802107–4802107
Publication date
2 February 2026