High-Field Angular I c Metrology for REBCO Tapes: Combined Pulsed-Current and Rotation Techniques

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Authors: Yuji Tsuchiya, S. Nojima, Alexandre Zampa, K. Mizuno, Yoshimitsu Kohama, S. Awaji
Cited by: 1
References: 48

Abstract

Understanding flux pinning and its angular dependence in REBCO coated conductors is essential for both vortex physics and next-generation high-field applications. However, conventional characterization methods suffer from inherent limitations: full-width tape measurements capture the total transport critical currentIcbut provide limited angular dependence, whereas microbridge measurements offer detailed angular dependence but may deviate from intrinsic performance of practical conductors. In this study, we developed a hybrid metrology that combines pulsed high-current measurement at fixed angles and rotation-based DC techniques to achieve comprehensiveIc(B,T,θ) characterization up to 24 T. The pulsed-current system supplies currents up to 5 kA for full-width tapes, while the rotational DC setup enables precise angular measurement on microbridges with currents up to 20 A. By using identical sample batches, we demonstrated that these two approaches provided complementary insights into high-field transport behavior. We further found that trapped magnetic fields around microbridges significantly influence theIcat low fields, emphasizing the importance of local field homogeneity for accurate flux-pinning evaluation. This combined methodology establishes a robust framework for assessing angular-dependent flux pinning under very high magnetic fields and provides valuable guidance for superconducting magnet design, materials optimization, and fundamental studies on vortex matter under extreme conditions.

Fields of Study & Subjects

Physics of Superconductivity and Magnetism Atomic and Subatomic Physics Research Advanced Electron Microscopy Techniques and Applications

Publication details

Journal / source
IEEE Transactions on Applied Superconductivity
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
36
Issue
5
Pages
1–7
Publication date
23 February 2026