Study on 3-D 1T1R Resistive Random Access Memory and Stacked Array for Chiplet Integration by Parallel Electrothermal Field-Circuit Co-Simulation

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2026

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Authors: Tan-Yi Li, Dongyan Zhao, Nian-En Zhang, Liming Xu, Hao-Xuan Zhang, Yin-Da Wang, Guangrong Li, Sichao Du, Fang Liu, Yingzong Liang, Yaxing Zhu, Hao Xie
+3 more Da-Wei Wang, Qiwei Zhan, Wen‐Yan Yin
DOI: 10.1109/tcad.2026.3661897
Cited by: 0
References: 45

Fields of Study & Subjects

Advanced Memory and Neural Computing VLSI and Analog Circuit Testing 3D IC and TSV technologies

Publication details

Journal / source
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume
45
Issue
10
Pages
4863–4875
Publication date
6 February 2026