Constellation Shaping for OFDM-ISAC Systems: From Theoretical Bounds to Practical Implementation

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Authors: Benedikt Geiger, Fan Liu, Shihang Lu, Andrej Rode, Daniel Gil Gaviria, Charlotte Muth, Laurent Schmalen
Cited by: 6
References: 28

Abstract

Integrated sensing and communications (ISAC) promises new use cases for mobile communication systems by reusing the communication signal for radar-like sensing. However, sensing and communications (S&C) impose conflicting requirements on the modulation format, resulting in a trade-off between their corresponding performance. This paper investigates constellation shaping as a means to simultaneously improve S&C performance in orthogonal frequency division multiplexing (OFDM)-based ISAC systems. We begin by deriving how the transmit symbols affect detection performance and derive theoretical lower and upper bounds on the maximum achievable information rate under a given sensing constraint. Using an autoencoder-based optimization, we investigate geometric, probabilistic, and joint constellation shaping, where joint shaping combines both approaches, employing both optimal maximum a-posteriori decoding and practical bit-metric decoding. Our results show that constellation shaping enables a flexible trade-off between S&C, can approach the derived upper bound, and significantly outperforms conventional modulation formats. Motivated by its practical implementation feasibility, we review probabilistic amplitude shaping (PAS) and propose a generalization tailored to ISAC. For this generalization, we propose a low-complexity log-likelihood ratio computation with negligible rate loss. We demonstrate that combining conventional and generalized PAS enables a flexible and low-complexity trade-off between S&C, closely approaching the performance of joint constellation shaping.

Fields of Study & Subjects

Advanced Wireless Communication Techniques Advanced Wireless Communication Technologies PAPR reduction in OFDM

Publication details

Journal / source
IEEE Transactions on Communications
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
74
Pages
6025–6042
Publication date
1 January 2026