A Dynamic Current Sharing Method for Multichip SiC Power Modules Based on Mutual Couplings

IEEE Transactions on Components Packaging and Manufacturing Technology 2026

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Authors: Xun Liu, Erping Deng, Xu Gao, Yifan Song, Xiao Zhang, Yameng Sun, Miao Li, Yang Zhou, Kun Ma, Sheng Liu
DOI: 10.1109/tcpmt.2026.3652176
Cited by: 1
References: 22

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Electromagnetic Compatibility and Noise Suppression Multilevel Inverters and Converters

Publication details

Journal / source
IEEE Transactions on Components Packaging and Manufacturing Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
16
Issue
2
Pages
259–267
Publication date
12 January 2026