A Broadband Bonding-Wire Compensation Technique Using Low-Pass Filter Topology and Elliptical Slot Structure for High-Speed Differential Interconnections
Abstract
In this paper, a broadband bonding-wire compensation technique with low-pass filtering topology and elliptical slot matching structure, is proposed for high-speed differential system in package. A wideband four-stage low-pass filter topology is constructed by the differential bonding wire interconnection and step-impedance compensation structure. In order to exactly predict the transmission behavior of the presented design, a rigorous equivalent circuit model with multi-coupling effect between the coupled bonding wires and skin effect at high frequency is developed. Moreover, the elliptical slot structure is etched under the tapered transmission line and is analyzed by the conformal transformation method, which can achieve wideband impedance matching at input/output ports. Good agreement can be observed between the simulation, and measurement results. A circuit sample is fabricated and measured with the differential signal return loss |Sdd11| of -11.2 dB from DC to 25 GHz.
Fields of Study & Subjects
Microwave Engineering and Waveguides
Electronic Packaging and Soldering Technologies
3D IC and TSV technologies
Publication details
- Journal / source
- IEEE Transactions on Components Packaging and Manufacturing Technology
- Volume
- 16
- Issue
- 3
- Pages
- 555–562
- Publication date
- 27 January 2026