Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling

IEEE Transactions on Components Packaging and Manufacturing Technology 2026

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Authors: Joshua Tompkins, Tijesunimi Akintunde, Mohammad Hazzaz Mahmud, Yue Zhao, David Ryan Huitink
DOI: 10.1109/tcpmt.2026.3661437
Cited by: 0
References: 25

Fields of Study & Subjects

Heat Transfer and Optimization Silicon Carbide Semiconductor Technologies Heat Transfer and Numerical Methods

Publication details

Journal / source
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume
16
Issue
3
Pages
476–485
Publication date
6 February 2026