Physics-Informed Machine Learning for Lifetime Prediction of Multi-layer Ceramic Capacitors

IEEE Transactions on Components Packaging and Manufacturing Technology 2026

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Authors: Tianyu Jiang, Faqiang Zhang, Jincheng Qin, Mingsheng Ma, Zhifu Liu
DOI: 10.1109/tcpmt.2026.3661614
Cited by: 0

Fields of Study & Subjects

Reliability and Maintenance Optimization Electronic Packaging and Soldering Technologies Machine Learning in Materials Science

Publication details

Journal / source
IEEE Transactions on Components Packaging and Manufacturing Technology
Pages
1–1
Publication date
1 January 2026