ThermoVision: Nondestructive Defect Mapping in 3-D Stacked Dies via Surface Thermography and Deep Learning

IEEE Transactions on Components Packaging and Manufacturing Technology 2026

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Authors: Chuanning Zhao, Junyong Sim, Sanghyeon Chang, Yunhyeok Im, Yoonjin Won
DOI: 10.1109/tcpmt.2026.3661910
Cited by: 0
References: 20

Fields of Study & Subjects

Integrated Circuits and Semiconductor Failure Analysis 3D IC and TSV technologies Thermography and Photoacoustic Techniques

Publication details

Journal / source
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume
16
Issue
4
Pages
757–764
Publication date
6 February 2026