TSV Topology-Driven Phase-Change Cooling in Interposer-Integrated Diverging Microchannels for 3D Electronic Packages

IEEE Transactions on Components Packaging and Manufacturing Technology 2026 Open access

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Authors: Sayan Karmakar, Anish Pal, Arani Mukhopadhyay, Md Naim Hossain, Constantine M. Megaridis
DOI: 10.1109/tcpmt.2026.3707060
Cited by: 1

Fields of Study & Subjects

3D IC and TSV technologies Phase-change materials and chalcogenides Nanofabrication and Lithography Techniques

Publication details

Journal / source
IEEE Transactions on Components Packaging and Manufacturing Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Pages
1–1
Publication date
1 January 2026