IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components Packaging and Manufacturing Technology 2026

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Authors: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tcpmt.5503870
Cited by: 83

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies

Publication details

Journal / source
IEEE Transactions on Components Packaging and Manufacturing Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication date
9 January 2026
Language
EN