Observation of Space Charge in BOPP Films under Extreme Electrothermal Coupling based on Thermal Pulse Method
Fields of Study & Subjects
Copper Interconnects and Reliability
Transition Metal Oxide Nanomaterials
Advanced Materials and Semiconductor Technologies
Publication details
- Journal / source
- IEEE Transactions on Dielectrics and Electrical Insulation
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Pages
- 1–1
- Publication date
- 1 January 2026