Iterative Optimization of Interface Conductivity on DC GIL Spacer Under Thermal Gradient
Fields of Study & Subjects
Advancements in Semiconductor Devices and Circuit Design
Silicon Carbide Semiconductor Technologies
Electromagnetic Simulation and Numerical Methods
Publication details
- Journal / source
- IEEE Transactions on Dielectrics and Electrical Insulation
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Pages
- 1–1
- Publication date
- 1 January 2026