Thermally Robust AlScN Memristors With Thickness-Optimized Resistive Switching for Harsh Environment

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Authors: Dongsheng Cui, Ruidong Li, Yu Liu, Xiangxiang Gao, Haidong Yuan, Jie Su, Zhenhua Lin, Jincheng Zhang, Yue Hao, Jingjing Chang
Cited by: 0
References: 29

Abstract

AlScN-based memristors exhibit significant potential for nonvolatile memory storage and neuromorphic computing applications. However, the mechanisms underlying resistive switching in AlScN-based devices at subcoercive fields remain an open question. Here, we present a single-layer AlScN-based memristor and investigate the impact of AlScN film thicknesses on storage performance. Remarkably, the storage window of the memristor increases progressively with increasing AlScN film thickness. The switching ratio reaches approximately 300 for the AlScN-based device. Moreover, the effects of high-temperature annealing on memristor performance demonstrate that the devices maintain excellent uniformity and reproducibility and preserve a well-defined memory window (~9) even after 10 min of thermal treatment at 1073 K.

Fields of Study & Subjects

Advanced Memory and Neural Computing Ferroelectric and Negative Capacitance Devices Semiconductor materials and devices

Publication details

Journal / source
IEEE Transactions on Electron Devices
Volume
73
Issue
3
Pages
1316–1319
Publication date
12 January 2026