Managing Trust in AI Systems: Evidence From Controlled Evaluation of Explanation Stability Under Data Imbalance

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Authors: Shamkhal Mammadov, Ismail Abdulrashid, Jiuh‐Biing Sheu
Cited by: 1
References: 48

Abstract

As advanced AI models are increasingly embedded in information systems to support organizational decision-making, the demand for explainable and trustworthy systems has grown significantly. While post-hoc explanation methods like SHAP and LIME are widely adopted to enhance interpretability and foster user trust, they often suffer from limitations such as instability in feature attributions, sensitivity to data sampling, and inconsistent outputs across iterations. This study proposes an explainable AI (XAI) artifact guided by the design science research (DSR) approach that systematically investigates the impact of class imbalance and sampling artifacts on the stability of feature explanations. Drawing on data from 2013–2023 across four integrated social media sources (BoxOfficeMojo, YouTube reviews, movie budget records, and metadata), we develop and evaluate a controlled sampling framework. The artifact incorporates (1) targeted class sampling to evaluate imbalance effects, (2) stability assessment using sequential rank agreement and coefficient of variation, and (3) robustness checks through variable stability index and coefficient stability index. Our findings highlight key factors that influence the reliability of SHAP and LIME outputs, based on 1,600 controlled simulation runs, multi-metric robustness checks (SRA, CV, VSI, CSI), and a design science–driven evaluation framework that explicitly isolates the effects of class imbalance. It also advances the development of responsible AI by enhancing the methodological rigor of explainability in socio-technical systems.

Fields of Study & Subjects

Explainable Artificial Intelligence (XAI) Access Control and Trust Ethics and Social Impacts of AI

Publication details

Journal / source
IEEE Transactions on Engineering Management
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
73
Pages
3083–3096
Publication date
1 January 2026