Suppression for UWB Simultaneous Switching Noise by Electromagnetic Bandgap With Helix Defected Ground Structure
Abstract
This article introduces an innovative helix defected ground electromagnetic bandgap (HDG-EBG) structure that realizes ultra-wideband (UWB) simultaneous switching noise (SSN) suppression for 3-D system-in-package (SiP) applications. The proposed architecture achieves remarkable performance metrics, including a consistent −30 dB suppression depth across a wide 315 MHz to 30 GHz bandwidth while maintaining an ultra-compact$0.0315\lambda _{L}\times 0.0315\lambda _{L}\times 0.00042\lambda _{L}$unit cell footprint – representing an 80% size reduction compared to conventional designs. Comprehensive characterization reveals a sevenfold stopband extension in 3 × 3 array configurations, with experimental results showing close agreement with full-wave simulations (within 3 MHz deviation at band edges). Rigorous benchmarking against state-of-the-art alternatives confirms the HDG-EBG’s superior suppression capability, attributed to its unique combination of L-bridge interconnects and optimized helix ground defects that effectively disrupt both parallel-plate waveguide modes and surface wave propagation. This breakthrough in electromagnetic interference mitigation addresses critical challenges in next-generation high-speed digital systems and multi-GHz RF/microwave applications where conventional approaches fail to simultaneously achieve broadband performance, miniaturization, and manufacturing feasibility. The structure’s versatility is further demonstrated through successful implementations in antenna performance enhancement and array decoupling applications, establishing it as a transformative solution for advanced packaging and communication systems.
Fields of Study & Subjects
Electromagnetic Compatibility and Noise Suppression
Radio Frequency Integrated Circuit Design
Microwave Engineering and Waveguides
Publication details
- Journal / source
- IEEE Transactions on Electromagnetic Compatibility
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Volume
- 68
- Issue
- 2
- Pages
- 424–436
- Publication date
- 12 January 2026