Suppression for UWB Simultaneous Switching Noise by Electromagnetic Bandgap With Helix Defected Ground Structure

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Authors: Panpan Zuo, Haokai Yang, Mengru Chen, Zhong-wei Hu, Tianwu Li, Gangzha Liu, Lei Yang, Er‐Ping Li
Cited by: 1
References: 45

Abstract

This article introduces an innovative helix defected ground electromagnetic bandgap (HDG-EBG) structure that realizes ultra-wideband (UWB) simultaneous switching noise (SSN) suppression for 3-D system-in-package (SiP) applications. The proposed architecture achieves remarkable performance metrics, including a consistent −30 dB suppression depth across a wide 315 MHz to 30 GHz bandwidth while maintaining an ultra-compact$0.0315\lambda _{L}\times 0.0315\lambda _{L}\times 0.00042\lambda _{L}$unit cell footprint – representing an 80% size reduction compared to conventional designs. Comprehensive characterization reveals a sevenfold stopband extension in 3 × 3 array configurations, with experimental results showing close agreement with full-wave simulations (within 3 MHz deviation at band edges). Rigorous benchmarking against state-of-the-art alternatives confirms the HDG-EBG’s superior suppression capability, attributed to its unique combination of L-bridge interconnects and optimized helix ground defects that effectively disrupt both parallel-plate waveguide modes and surface wave propagation. This breakthrough in electromagnetic interference mitigation addresses critical challenges in next-generation high-speed digital systems and multi-GHz RF/microwave applications where conventional approaches fail to simultaneously achieve broadband performance, miniaturization, and manufacturing feasibility. The structure’s versatility is further demonstrated through successful implementations in antenna performance enhancement and array decoupling applications, establishing it as a transformative solution for advanced packaging and communication systems.

Fields of Study & Subjects

Electromagnetic Compatibility and Noise Suppression Radio Frequency Integrated Circuit Design Microwave Engineering and Waveguides

Publication details

Journal / source
IEEE Transactions on Electromagnetic Compatibility
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
68
Issue
2
Pages
424–436
Publication date
12 January 2026