Conducted Emission Behavior Model for System-in-Package Based on Multivariate Fitting

This article proposes and validates a novel approach to establish a behavior model for characterizing conducted emissions from system-in-package (SiP) chip. The method is based on data fromS-parameter extraction and conducted emission measurements. By analyzing key parameters influencing the generation of conducted emissions, a typical correlation analysis is implemented to evaluate the correlation between the key parameters and noise sources. The mapping relationship between the main parameters and conductive emissions is then modeled using multivariate neural network fitting methods. Thereafter, a behavioral model reflecting the conductive emission characteristics of the SiP chip is constructed based on the ICEM-CE modeling standard. The method has been validated on real datasets of several functional modules in SiP chip, proving its effectiveness and accuracy. This method has a broad substantial application potential for evaluating electromagnetic compatibility (EMC) characteristics of systems and equipment.