A Three-Step Data Acquisition Optimization Algorithm for Hourly 3-D Deformation Field Construction Based on GNSS-InBSAR

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Authors: Feifeng Liu, Jingtian Zhou, Zhanze Wang, Zhixiang Xu
Cited by: 3
References: 46

Abstract

Global navigation satellite system (GNSS) based bistatic synthetic aperture radar interferometry (InBSAR) system enables 3D deformation monitoring through the association of measurements from multiple navigation satellites. The system can further utilize diverse satellite combinations to obtain 3D measurements at different time periods, overcoming the re-orbit time limitations of traditional InSAR and achieving hourly deformation monitoring. However, the abundance of navigation satellites introduces significant flexibility in transmitter selection, and the constrained data processing capacity of receivers poses critical challenges for high-frequency data acquisition design. This paper proposes a three-step data acquisition optimization algorithm for hourly 3D deformation field construction based on GNSS-InBSAR. Firstly, receiver location is optimized based on the uniform distribution assumption of transmitters. Secondly, a multi-factor optimization model is established to obtain high-quality acquisition time points and corresponding satellite combination, including evaluation algorithms for mirror image interference and theoretical 3D deformation accuracy. Finally, the optimal acquisition plan is generated using the greedy algorithm, accompanied by a short interval deformation output method. Experimental validation using BeiDou Navigation Satellite System (BDS) raw data demonstrates the algorithm’s effectiveness in achieving 3D deformation monitoring at 2-hour interval. The 3D deformation monitoring accuracy is verified by differential GNSS equipment.

Fields of Study & Subjects

GNSS positioning and interference Synthetic Aperture Radar (SAR) Applications and Techniques Soil Moisture and Remote Sensing

Publication details

Journal / source
IEEE Transactions on Geoscience and Remote Sensing
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
64
Pages
1–16
Publication date
1 January 2026