HL-SAM-Seg: Complementary High- and Low-Resolution Features Based on SAM for Remote Sensing Image Semantic Segmentation

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Authors: Siting Xiong, Linfeng Wu, Bochen Zhang, Dejin Zhang, Yu Tao, Yuzhi Tang
Cited by: 3
References: 39

Abstract

The groundbreaking segment anything model (SAM), built on a vision transformer (ViT) design with millions of parameters and trained on the large SA-1B dataset, acts as a vision foundation model that can be used for various segmentation tasks. However, this model cannot be directly applied to the semantic segmentation of remote sensing images, as it tends to over-segment objects rather than preserving their semantics. Furthermore, it does not align well with object boundaries, which are usually required for the high-accuracy segmentation of high-resolution remote sensing images. To address this issue, we adjust the image encoder and mask decoder of SAM and propose an HL-SAM-Seg network. The image encoder is extensively adjusted to comprise an adapter, a high-resolution (high-res) path, and a low-resolution (low-res) path. The latter two paths extract and update the high-res and low-res features, which are merged in the mask decoder to perform multi-class segmentation. Specifically, we design a highlow- resolution cross-attention (HL) module inserted into the transformer blocks of the low-res path to align and update the low-res and high-res features. Experimental results on the ISPRS Vaihingen, ISPRS Potsdam, and FloodNet datasets show that the proposed HL-SAM-Seg outperformed conventional state-of-theart semantic segmentation algorithms overall, with underperformance in some small sample categories. Moreover, it has fewer trainable parameters, suggesting the potential for leveraging SAM for remote sensing image segmentation.

Fields of Study & Subjects

Advanced Neural Network Applications Remote-Sensing Image Classification Automated Road and Building Extraction

Publication details

Journal / source
IEEE Transactions on Geoscience and Remote Sensing
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
64
Pages
1–14
Publication date
1 January 2026