Overcoming Correlation Degradation in Photoacoustic Spectroscopy: High-Precision Gas Concentration Prediction With a GA-Optimized Dual Stacking Architecture

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Authors: Zhenzhou Su, Pengpeng Wang, Tianxiang Zhao, Fupeng Wang, Cunguang Zhu
Cited by: 1
References: 38

Abstract

Systematic residuals induced by correlation degradation represent a critical bottleneck in gas concentration prediction using photoacoustic spectroscopy (PAS). Conventional models, particularly those with single-layer architectures, lack an explicit residual correction mechanism, making it challenging to mitigate these systematic biases. To address this challenge, a multilayer perceptron model, termed GA-DSA-MLP, is proposed by integrating a Dual Stacking Architecture (DSA) with Genetic Algorithm (GA) optimization. Through a two-stage mapping mechanism, the model achieves explicit modeling and rectification of systematic residuals, effectively alleviating the limitations of traditional single-layer networks in feature extraction and error self-correction. Complementing this architecture, the global search capability of the GA provides robust parameter initialization to enhance feature extraction performance under severe correlation degradation. Experimental results demonstrate that the GA-DSA-MLP surpasses benchmarks like OLS and PSO-EAP-CNN by over 70% in key error metrics. The model requires approximately 17 ms for single inference, with 89.3% of samples exhibiting a relative error below 0.5%. Overall, this work presents a novel lightweight end-to-end model that, to our knowledge, is the first to incorporate an explicit residual correction mechanism specifically for addressing PAS correlation degradation. It provides a reproducible and effective framework for high-precision gas concentration prediction.

Fields of Study & Subjects

Spectroscopy and Laser Applications Air Quality Monitoring and Forecasting Advanced Chemical Sensor Technologies

Publication details

Journal / source
IEEE Transactions on Instrumentation and Measurement
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
75
Pages
1–11
Publication date
1 January 2026