The Sedpgram: A Novel Optimal Demodulation Frequency Band Selection Framework for Multitype Gearbox Early Fault Diagnosis

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Authors: Laixing Li, Jingbu Wei, Yuhang Wang, Wanming Ying, Khandaker Noman, Yongbo Li
Cited by: 2
References: 30

Abstract

Early fault detection in multi-type gearbox remains a critical challenge, as weak fault-induced signals are frequently overwhelmed by strong ambient noise and operational interference. Existing methods are primarily tailored for fault characteristics of a single gearbox type, severely limiting their applicability and robustness in complex industrial gearboxes. While Optimal Demodulation Frequency Band (ODFB) analysis is a potent feature extraction technique, its performance is fundamentally constrained by frequency band segmentation strategies and the design of optimization metrics. To address this issue, this paper proposes a novel ODFB selection framework on the Spectral Energy Distribution Probability (SEDP) gram to robustly extract multi-type gearbox fault features. Its framework prioritizes identifying the most informative band center frequency using the SEDP metric—which quantifies the concentration of characteristic energy. Subsequently, a binary tree algorithm is employed to adaptively segment the frequency spectrum, recursively approximating the identified center frequency. Crucially, the Demodulation Sideband Retention (DSR) ratio is used to autonomously determine the optimal segmentation level, ensuring maximal retention of fault information while suppressing noise. This framework enables effective multi-type gearbox fault diagnosis solely through preset parameter fine-tuning. Validation using the NWPU multi-type gearbox datasets demonstrates that proposed method outperforms traditional ODFB methods in enhancing early fault features.

Fields of Study & Subjects

Machine Fault Diagnosis Techniques Gear and Bearing Dynamics Analysis Bladed Disk Vibration Dynamics

Publication details

Journal / source
IEEE Transactions on Instrumentation and Measurement
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
75
Pages
1–14
Publication date
1 January 2026