Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection

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Authors: Yiru Xiao, Bo Feng, Yizhou Guo, Kai Wang, Yini Song, Zhe Wang, Yihua Kang
Cited by: 2
References: 37

Abstract

The conventional electromagnetic acoustic transducer (EMAT) testing method has inherent limitations, particularly in its detection range. Combining EMAT with other nondestructive testing (NDT) methods can expand the detection range and improve accuracy. Most EMAT-based dual testing methods can detect surface and backside defects, but cannot be applied in high-speed inspection conditions. Therefore, this paper proposes a dual testing method that combines EMAT with motion-induced eddy current (MIEC), enabling the detection of defects on both the surface and backside of the specimen under high-speed conditions. The probe consists of a permanent magnet and a butterfly coil. First, the principles of EMAT and MIEC are analyzed, along with the interactions and interferences between the two methods. A signal separation technique is proposed based on spectral analysis of the individual EMAT and MIEC signals. A 2D simulation model was developed to assess the detection range of both methods and evaluate the impact of the MIEC effect on EMAT detection. Experimental verification confirmed the effectiveness of the method, and the sensitivity and stability of the probe were also evaluated. The results show that the dual EMAT-MIEC testing method effectively detects millimeter-scale cracks on both surfaces and backsides at a speed of up to 21 m/s.

Fields of Study & Subjects

Non-Destructive Testing Techniques Electron and X-Ray Spectroscopy Techniques Ultrasonics and Acoustic Wave Propagation

Publication details

Journal / source
IEEE Transactions on Instrumentation and Measurement
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
75
Pages
1–9
Publication date
1 January 2026