Robust Self-Supervised Monocular Depth Estimation for Endoscopic Soft Tissue Deformation Scenes With Biomechanical Constraints

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Authors: Enpeng Wang, Jiangchang Xu, Yueang Liu, Puxun Tu, J. L. Wang, Xiaoyi Jiang, Xiaojun Chen
Cited by: 1
References: 45

Abstract

Self-supervised learning technology has been applied to calculate depth and ego-motion from monocular videos, achieving remarkable performance in various real-world scenarios. Unfortunately, challenges such as specular reflections and soft tissue deformations in endoscopic scenes greatly undermine the performance of these methods, inevitably compromising the accuracy of depth and ego-motion estimation. To address these two problems, we introduce a novel strategy based on image distance transform for robust self-supervised learning for monocular depth estimation, effectively handling specular reflections in endoscopic scenes. Furthermore, we propose a soft tissue deformation constraint based on biomechanical principles, which mitigates the adverse effects of deformed region pixels, ultimately enhancing the model's depth estimation precision. Additionally, our method employs a lightweight architecture ensuring a reduced number of model parameters and faster inference time. Extensive experiments are conducted on both public datasets (SCARED, SERV-CT) and our own datasets to validate the effectiveness of our method. Compared with other SOTA methods, our approach demonstrates comparable accuracy and robustness while ensuring faster inference time. On the SCARED dataset, our approach attains an RMSE of 4.96 mm with only 2.25M model parameters for depth estimation. Especially, experiment results on SERV-CT dataset and our own datasets further demonstrate the model's generalization ability and potential clinical value in computer-assisted surgical navigation.

Fields of Study & Subjects

Advanced Vision and Imaging 3D Shape Modeling and Analysis Optical measurement and interference techniques

Publication details

Journal / source
IEEE Transactions on Image Processing
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
35
Pages
556–568
Publication date
1 January 2026
Language
EN